Examples of Z CLEAN™ S81G in use.
Condition
- Molding machine type
- Injection molding machine (80t)
- Preceding resin
- PEEK / GF30% Sliver
- Succeeding resin
- PC
- Temperature conditions
- C1：698 C2：698 C3：698 N：698（℉）
C1：370 C2：370 C3：370 N：370（℃） - Molding machine conditions
- Screw rotation 50%
- Injection conditions
- Back pressure conditions 0mPa
- Test materials
- ① S81G New development product
② S80G Conventional product
③ Competitor's product
Result of purging
① S81G
PURGING PROCESS
PEEK⇒S81G
| CLEANING CONDITION | The developed product has stable lump during purging and has good performance without any problems with workability. |
|---|---|
| AMOUNT OF PURGING AGENT | 400g |
② S80G
PURGING PROCESS
PEEK⇒S80G
| CLEANING CONDITION | The conventional products are difficult to handle because the lump are unstable during purging. |
|---|---|
| AMOUNT OF PURGING AGENT | 500g |
③ Competitor's product
PURGING PROCESS
PEEK⇒Competitor's product
| CLEANING CONDITION | When using competitor's product, discoloration occurs after replacing with PC. |
|---|---|
| AMOUNT OF PURGING AGENT | 800g |
Result
The developed purging agent S81G uses less resin than the conventional S80G, making it useful for color changing and translating from PEEK resin at 698℉（370℃）.